SK has been granted a patent for an innovative MDO thermoresistant heat-shrinkable multilayer film made of copolymer polyester. The film includes multiple skin layers for improved thermal resistance and high shrinkage properties through MD orientation. The film is designed with specific components and properties to enhance performance. GlobalData’s report on SK gives a 360-degree view of the company including its patenting strategy. Buy the report here.
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According to GlobalData’s company profile on SK, UAV battery thermal mgmt was a key innovation area identified from patents. SK's grant share as of February 2024 was 49%. Grant share is based on the ratio of number of grants to total number of patents.
Patent granted for mdo thermoresistant heat-shrinkable multilayer film
A recently granted patent (Publication Number: US11926117B2) discloses an innovative MDO thermoresistant heat-shrinkable multilayer film. The film comprises a substrate layer and a skin layer made of copolymer polyester resin derived from terephthalic acid and diol components. The substrate layer includes diethylene glycol, ethylene glycol, and other monomers, while the skin layer contains 1,4-cyclohexanedimethanol, diethylene glycol, ethylene glycol, and isosorbide. Notably, the skin layer's isosorbide content ranges from 1 mol % to 60 mol %, contributing to its high glass transition temperature (Tg) of 85° C. or more. The film's unique composition allows for stretching in the machine direction (MD) by 2 to 5 times, resulting in a maximum heat shrinkage of 50% or more at 95 to 100° C. while maintaining low transverse direction (TD) shrinkage of 5% or less at 100° C. The film also exhibits a shrink initiation temperature of 70° C. or more, haze of 5% or less, and a total thickness ranging from 10 to 60 µm.
Furthermore, the patent includes additional claims for the MDO thermoresistant heat-shrinkable multilayer film, such as the incorporation of C8-14 aromatic dicarboxylic acid components and C4-12 aliphatic dicarboxylic acid components in the acid component. The diol composition in the skin layer is specified to include 30 mol % to 50 mol % of 1,4-cyclohexanedimethanol, 1 mol % to 3 mol % of diethylene glycol, and 9.5 mol % to 55 mol % of isosorbide, while the substrate layer comprises different proportions of diethylene glycol and 1,4-cyclohexanedimethanol. Additionally, a coating layer with various additives like processing aids, UV absorbers, and flame retardants can be applied to the skin layer. The patent emphasizes the importance of the copolymer polyester resin's Tg in the skin layer, ranging from 95° C. to 130° C., to ensure the film's thermoresistant properties.
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GlobalData’s Patent Analytics tracks patent filings and grants from official offices around the world. Textual analysis and official patent classifications are used to group patents into key thematic areas and link them to specific companies across the world’s largest industries.
