Thermally Conductive, Low Modulus Epoxy Meets NASA Low Outgassing Specifications

Master Bond EP55TCFL is a thermally conductive, electrically insulating epoxy system developed for bonding, sealing, coating, and small potting applications. It meets NASA low outgassing specifications and incorporates a filler with small particle sizes, enabling application in thin bond lines to minimise thermal resistance. The system is 100% reactive, contains no solvents or diluents, and exhibits low shrinkage upon cure.

The material provides a thermal conductivity of 3.2W–3.8W/(m•K) and a volume resistivity greater than 10^14 ohm-cm at 25°C. It features a low tensile modulus of 8,000psi–12,000psi, an elongation of 10%–20%, and a Shore D hardness of 55–65, providing flexibility and thermal cycling capabilities. EP55TCFL is serviceable over a temperature range of -50°C to +125°C and adheres to substrates including metals, composites, ceramics, and many plastics.

EP55TCFL is available as a two-part system or as a one-part premixed and frozen system. The two-part version has a 100:15 mix ratio by weight, a mixed viscosity of 30,000–60,000 cps, and a working life of two to four hours for a 100g batch at 25°C. It cures with elevated temperature schedules of four to six hours at 50°C–70°C or three to four hours at 80°C–90°C. Packaging options include one-ounce, four-ounce, and eight-ounce jars for the two-part formulation, as well as 3cc, 5cc, and 10cc premixed and frozen syringes.

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